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this is information on a product in full production. october 2013 docid025035 rev 2 1/11 11 BALF-SPI-01D3 50 ohm nominal input / conjugate match balun to spirit1, with integrated harmonic filter datasheet ? production data figure 1. pin coordinates (top view) figure 2. application schematic (top view) features ? 50 nominal input / conjugate match to spirit1 ? low insertion loss ? low amplitude imbalance ? low phase imbalance ? small footprint benefits ? very low profile (< 670 m) ? high rf performance ? rf bom and area reduction applications ? 868 mhz and 915 mhz impedance matched balun filter ? optimized for spirit1 sub ghz rfic description stmicroelectronics BALF-SPI-01D3 is an ultraminiature balun. the BALF-SPI-01D3 integrates matching network and harmonics filters. matching impedance has been customized for the spirit1 st transceiver. the BALF-SPI-01D3 uses stmicroelectronics ipd technology on non-conductive glass substrate which optimize rf performances. flip-chip package 6 bumps ant gnd1 gnd2 12 rx_p a b rx_n tx c spirit1 1 2 3 4 5 15 14 13 12 11 20 19 18 17 16 6 7 8 9 10 balf - spi -01d3 1.8 - 3.6 v 1 .8 - 3.6 v antenna digital interface (50 ) c9 r0 l0 xtal c10 l7 l8 c11 c12 c13 c0 cx miso mosi sclk csn rf p rf n gpio0 smps ext1 smps ext2 tx rbias sdn gpio1 gpio2 gpio3 vreg vbat vbat xin xout www.st.com
characteristics BALF-SPI-01D3 2/11 docid025035 rev 2 1 characteristics table 1. absolute maximum ratings (limiting values) symbol parameter value unit min. typ. max. p in input power rfin 20 dbm v esd esd ratings human body model (jesd22-a114-c), all i/o one at a time while others connected to gnd 2000 v esd ratings machine model, all i/o 200 t op operating temperature (jesd22-a115-c), all i/o -40 +85 c table 2. impedances (t amb = 25 c) symbol parameter value unit min. typ. max. z rx nominal differential rx balun impedance match to spirit1 z tx nominal tx filter impedance z ant antenna impedance 50 table 3. rf performance (t amb = 25 c) symbol parameter test condition value unit min. typ. max. f frequency range (bandwidth) 779 868 956 mhz s21 rx-ant insertion loss in bandwidth without mismatch loss (rx balun) -1.7 -2 db s21 tx-ant insertion loss in bandwidth without mismatch loss (tx filter) -1.4 -2 db s11 ant input return loss in bandwidth (rx balun) -23 -15 db s11 ant input return loss in bandwidth (tx filter) -15 -12 db imb output phase imbalance (rx balun) 5 10 15 a imb output amplitude imbalance (rx balun) 0.35 0.8 db att harmonic levels (tx filter) attenuation at 2fo -35 dbm attenuation at 3fo -40
docid025035 rev 2 3/11 BALF-SPI-01D3 characteristics 1.1 rf measurement (rx balun) figure 3. insertion loss (t amb = 25 c) figure 4. return loss antenna (t amb = 25 c) 779 839 899 939 956 799 819 859 879 919 0.0 -0.5 -1.0 -1.5 -2.0 -2.5 -3.0 f (mhz) (db) -0 -5 -10 -15 -20 -25 779 779 839 839 899 899 939 939 956 956 799 799 819 819 859 859 879 879 919 919 f (mhz) (db) figure 5. phase imbalance (t amb = 25 c) figure 6. amplitude imbalance (t amb = 25 c) 20 15 10 5 0 779 779 839 839 899 899 939 939 956 956 799 799 819 819 859 859 879 879 919 919 f (mhz) (deg) 0.0 0.4 0.8 0.2 0.6 1.0 779 779 839 839 899 899 939 939 956 956 799 799 819 819 859 859 879 879 919 919 f (mhz) (db)
characteristics BALF-SPI-01D3 4/11 docid025035 rev 2 1.2 rf measurement (tx filter) figure 7. transmission (t amb = 25 c) figure 8. insertion loss (t amb = 25 c) 0.4 1.0 1.2 2.0 2.4 2.6 2.8 0.6 0.8 1.4 1.6 1.8 2.2 0.0 -10 -20 -30 -40 -50 f (ghz) (db) -0 -0.5 -1.0 -1.5 -2.0 -2.5 f (mhz) (db) 779 779 839 839 899 899 939 939 956 956 799 799 819 819 859 859 879 879 919 919 figure 9. attenuation (t amb = 25 c) figure 10. return loss antenna (t amb = 25 c) 0.0 -10 -20 -30 -40 -50 f (ghz) 2f0 3f0 (dbm) 1.6 1.8 2.0 2.2 2.6 2.4 2.8 f (mhz) 0 -5 -10 -15 -20 (db) 779 779 839 839 899 899 939 939 956 956 799 799 819 819 859 859 879 879 919 919
docid025035 rev 2 5/11 BALF-SPI-01D3 application information 2 application information figure 11. application board evb (4 layers) figure 12. tx output measurements with BALF-SPI-01D3 at 868 mhz 0 1 2 3 4 5 6 7 8 9 10 11 12 13 012345678910111213 measured output power (dbm) requested power (dbm)
application information BALF-SPI-01D3 6/11 docid025035 rev 2 figure 13. tx output power measurements over frequency with BALF-SPI-01D3 figure 14. harmonic measurements at p out = 10 dbm with BALF-SPI-01D3 -2 0 2 4 6 8 10 12 800 820 840 860 880 900 920 940 960 f (mhz) +10 dbm mode 0 dbm mode measured output power (dbm) 868 mhz 915 920 mhz - -90 -80 -70 -60 -50 -40 -30 0 1000 2000 3000 4000 5000 6000 7000 8000 9000 10000 f (mhz) h 2 h 3 h 4 h 5 h 6 h 7 h 8 att (db)
docid025035 rev 2 7/11 BALF-SPI-01D3 package information 3 package information ? epoxy meets ul94, v0 ? lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 15. package dimensions (top and side view) 0.295 mm 0.195 mm 0.200 mm 1.4 mm 1 mm 2 mm view through 0.5 mm 0.82 mm 0.4 mm 0.650 mm a1 b1 c1 a2 b2 c2 diam: 0.250 mm
package information BALF-SPI-01D3 8/11 docid025035 rev 2 figure 16. recommended balun land pattern figure 17. footprint - non solder mask defined figure 18. footprint - solder mask defined 125 m copper pads = 220 m rx ground clearance 130 microns tx/ant ground clearance 100 microns 1290 m 1125 m 1590 m 1325 m copper pad diameter: 220 m recommended 180 m minimum 260 m maximum solder mask opening: 320 m recommended 300 m minimum 340 m maximum solder stencil opening: 220 m recommended line to connect copper pad on solder mask opening shopuld be smaller than copper pad diameter solder mask opening : 220 m recommended 180 m minimum 260 m maximum copper pad diameter : 320 m recommended 300 m minimum solder stencil opening : 220 m recommended
docid025035 rev 2 9/11 BALF-SPI-01D3 package information figure 19. marking figure 20. flip chip tape and reel specifications note: more information is available in the stmicroelectronics application note: an2348 flip-chip: ?package description and recommendations for use? x y x w z w dot, st logo ecopack grade xx = marking z = manufacturing location yww = datecode dot identifying pin a1 location user direction of unreeling all dimensions are typical values in mm 4.0 4.0 2.0 8.0 1.75 3.5 ? 1.55 0.73 1.5 0.22 2.1 x x x x x x y y y y y y x x x x x x w w w w w w zz z zz w w w w w
ordering information BALF-SPI-01D3 10/11 docid025035 rev 2 4 ordering information 5 revision history table 4. ordering information order code marking weight base qty delivery mode BALF-SPI-01D3 sj 3.0 mg 5000 tape and reel table 5. document revision history date revision changes 27-aug-2013 1 initial release 03-oct-2013 2 updated document title. updated table 1 with jesd22 references.
docid025035 rev 2 11/11 BALF-SPI-01D3 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2013 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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